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Microelectromechanical Systems (MEMS) An introduction Jr-Lung (Eddie) Lin Department of Mechanical and Automation Engineering, I-Shuo University Email: ljl@isu.edu.tw

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Outline Introduction Applications Passive structures Sensors Actuators Future Applications MEMS micromachining technology Bulk micromachining Surface micromachining LIGA Wafer bonding Thin film MEMS Motivation Microresonators MEMS resources Conclusions

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What are MEMS? (Micro-electromechanical Systems) Fabricated using micromachining technology Used for sensing, actuation or are passive micro-structures Usually integrated with electronic circuitry for control and/or information processing

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3-D Micromachined Structures

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3-D Micromachined Structures

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Applications: Passive Structures

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Applications: Sensors Pressure sensor: Piezoresistive sensing Capacitive sensing Resonant sensing Application examples: Manifold absolute pressure (MAP) sensor Disposable blood pressure sensor (Novasensor)

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Piezoresistive Pressure Sensors

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Piezoresistive Pressure Sensors

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Applications: Sensors Acceleration Air bag crash sensing Seat belt tension Automobile suspension control Human activity for pacemaker control Vibration Engine management Security devices Monitoring of seismic activity Angle of inclination Vehicle stability and roll

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Accelerometers

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Accelerometers

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Capacitive Accelerometers

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Applications: Actuators Texas Instruments Digital Micromirror DeviceTM

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Digital Micromirror Device

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Digital Micromirror Device

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Some future applications Biological applications: Microfluidics Lab-on-a-Chip Micropumps Resonant microbalances Micro Total Analysis systems Mobile communications: Micromechanical resonator for resonant circuits and filters Optical communications: Optical switching

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Microfluidics / DNA Analysis

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Basic microfabrication technologies Deposition Chemical vapor deposition (CVD/PECVD/LPCVD) Epitaxy Oxidation Evaporation Sputtering Spin-on methods Etching Wet chemical etching Istropic Anisotropic Dry etching Plasma etch Reactive Ion etch (RIE, DRIE) Patterning Photolithography X-ray lithography

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Bulk micromachining

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Bulk micromachining

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Bulk micromachining: Pressure sensors

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Surface Micromachining

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Surface Micromachining

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Surface Micromachining

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Surface Micromachining

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LIGA – X-ray Lithography, Electroplating (Galvanoformung), Molding (Abformung)

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LIGA

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Wafer bonding- Anodic

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Summary: MEMS fabrication MEMS technology is based on silicon microelectronics technology Main MEMS techniques Bulk micromachining Surface micromachining LIGA and variations Wafer bonding